
3
CM75TU-24F
Trench Gate Design Six IGBTMOD™
75Amperes/1200 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Dynamic Electrical Characteristics, T
j
= 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance C
ies
––29 nf
Output Capacitance C
oes
V
CE
= 10V, V
GE
= 0V ––1.3 nf
Reverse Transfer Capacitance C
res
––0.75 nf
Inductive Turn-on Delay Time t
d(on)
V
CC
= 600V, I
C
= 75A, ––100 ns
Load Rise Time t
r
V
GE1
= V
GE2
= 15V, ––50 ns
Switch Turn-off Delay Time t
d(off)
R
G
= 4.2⍀, ––400 ns
Times Fall Time t
f
Inductive Load ––300 ns
Diode Reverse Recovery Time** t
rr
Switching Operation ––150 ns
Diode Reverse Recovery Charge** Q
rr
I
E
= 75A – 3.1 – µC
Thermal and Mechanical Characteristics, T
j
= 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R
th(j-c)
Q Per IGBT 1/6 Module, T
c
Reference – 0.28 °C/W
Point per Outline Drawing
Thermal Resistance, Junction to Case R
th(j-c)
D Per FWDi 1/6 Module, T
c
Reference ––0.47 °C/W
Point per Outline Drawing
Thermal Resistance, Junction to Case R
th(j-c)
'Q Per IGBT 1/6 Module, – 0.19 °C/W
T
c
Reference Point Under Chip
Contact Thermal Resistance R
th(c-f)
Per Module, Thermal Grease Applied – 0.015 – °C/W
** Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
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