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VISHAY HIGH POWER PRODUCTS

Modules

Application Note AN-0801

Mounting Instructions for MTP Modules

APPLICATION NOTE

Document Number: 95002 For technical support, contact ind-modules@vishay.com www.vishay.com

Revision: 02-Jul-08 1

By Marcello Turnaturi, Vishay Semiconductors

This application note introduces Vishay´s MTP

rectifier-switch modules and discusses the assembly and

printed circuit board issues involved in their use.

MTP modules are designed to provide reliable performance

in rugged 20 A to 100 A industrial applications. A single

housing is used to integrate power components, providing

higher power density. Various die selections are available in

several configurations. An integrated thermal sensor is also

offered as an option.

Fig. 1 - Example of MTP module

Introduction

Vishay´s MTP modules are distinguished by these key

features:

• Fully isolated

• Compact and easy to mount

• Low profile package suitable for assembly on printed

circuit boards

• Low junction to case thermal resistance

These attributes allow MTP modules to fit into existing

assembly processes using standard reflow profiles.

Important factors in the assembly process are:

• Heatsink design

• PCB design

• Power leads size/area

• Distance from adjacent heating parts

• Solder paste choice

• Reflow profile

• Protection against electrostatic discharge (ESD)

Recommendations for each of these items and requirements

for mounting MTP modules to the PCB are discussed in the

following sections.

ESD protection

IGBT and MOSFET modules are sensitive to ESD. All

MTP modules are ESD-protected during shipment with an

antistatic tube. Anyone handling or working with the

modules during the assembly process must wear a

conductive grounded wristband.

Heatsink Specification

The contact surface of the heatsink must be flat, with a

recommended tolerance of < 0.03 mm (< 1.18 mils) and a

levelling depth of < 0.02 mm (< 0.79 mils), according to

DIN/ISO 1302. In general, a milled or machined surface is

satisfactory if prepared with tools in good working

condition. The heatsink mounting surface must be clean,

with no dirt, corrosion, or surface oxide. It is very important

to keep the mounting surface free from particles exceeding

0.05 mm (2 mils) in thickness

1 2

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VISHAY HIGH POWER PRODUCTSModulesApplication Note AN-0801Mounting Instructions for MTP ModulesAPPLICATION NOTE Document Number: 95002 For technical su

Pagina 2

Mounting Instructions for MTP ModulesApplication Note AN-0801Vishay High Power Products www.vishay.com For technical support, contact ind-modules@vish

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